Product Summary
AOI Automatic optical inspection equipment is used to detect the quality and accuracy of gold wire connections on packaged chips. It uses high-resolution 2D/3D cameras and AI image processing algorithms to quickly and accurately detect and analyze gold wire connections on packaged chips. It can detect parameters such as the welding condition, position, height, offset, and other parameters of the gold wire, and identify a variety of anomalies or defects, such as poor welding, breakage, offset, and other problems. By promptly discovering and repairing problems with gold wire connections, it helps to improve the quality and reliability of packaged chips and reduce the defective rate of chips.
AOI Gold wire bonding
Product Features
1.Gold wire bonding inspection
Detect the morphological parameters of bonding wires (usually gold, copper or aluminum wires), including wire arc height, length, position, diameter, breakage, curvature, short circuit and other defects.
2.Solder joint quality analysis
Check the integrity of the bonding points (first solder joint, second solder joint), such as offset, cold solder joint, pad contamination, etc.
3.3D shape reconstruction
Some high-end models can achieve 3D profile measurement of gold wire through multi-angle optical imaging or laser scanning.
Product Properties
The AOI equipment's unique optical system and detection algorithm are used for high-speed, high-sensitivity crystal defect detection and classification.
2D & 3D optional, 3D measurement Z-axis accuracy up to 8 μm
UPH: ≥5000pcs/h
AOI 2D Detection
AOI 3D Detection
Product application
● AOI equipment inspection content: missed wire, wrong wire, flying wire, double wire, poor wire arc, gold wire residue, gold wire short circuit, solder ball detachment, fishtail detachment, solder ball XY size, solder ball offset, fishtail XY size, fishtail offset, wired without ball, capacitor detachment, capacitor offset, tombstone, dirty capacitor, damaged driver IC, detached driver IC, dirty driver IC, scratched photosensitive chip, damaged photosensitive chip, dirty photosensitive chip.
AOI Automatic optical inspection equipment is a key link to ensure the reliability of the bonding process and is widely used in the quality control of semiconductor back-end packaging. If you need a more efficient solution, please consult Huizhou Zhongke Advanced Manufacturing Co., Ltd.
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Technical Parameters
● Resolution: 0.5μm~5μm (depending on lens configuration)
● Detection speed: several to dozens of frames per second (related to the size of the field of view)
● Applicable wire diameter: 15μm~100μm (gold wire/copper wire)
● Repeatability: ±1μm~±3μm
Product Specification
|
External Size |
L1000*W800*H1500 mm |
|
Power supply |
2KW, AC220 V |
|
Weight |
800Kg |
